发明申请
US20090211083A1 Method and Assembly For Extracting And Installing Dual In-Line Memory Module Cardlets
有权
用于提取和安装双列直插式内存模块卡夹的方法和装配
- 专利标题: Method and Assembly For Extracting And Installing Dual In-Line Memory Module Cardlets
- 专利标题(中): 用于提取和安装双列直插式内存模块卡夹的方法和装配
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申请号: US12036664申请日: 2008-02-25
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公开(公告)号: US20090211083A1公开(公告)日: 2009-08-27
- 发明人: Paul F. Bodenweber , John J. Loparco , Thong N. Nguyen , Thomas Ramundo , John G. Torok
- 申请人: Paul F. Bodenweber , John J. Loparco , Thong N. Nguyen , Thomas Ramundo , John G. Torok
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: B23P19/00
- IPC分类号: B23P19/00
摘要:
A method and a tool assembly for engaging and disengaging a cardlet housing electronic components from a computer environment. The cardlet, in a preferred embodiment is a dual in-line memory module (DIMM) cardlet. The tool comprises a carrier having a handle on one end and a plurality of retention features and engaging members on an opposing side. The carrier release mechanism is secured to the carrier and the engaging members such that activating the carrier release mechanism moves the engaging members from a first to a second position such that engagement and disengagement of the carrier and said cardlet housing electronic components can be achieved. In addition, a removable latch release member is also secured to the carrier, the release member having a durable tip for engaging and disengaging latches on the computer cardlet without damaging the cardlet or its surrounding sensitive components.
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