发明申请
- 专利标题： COOLING PLATES AND SEMICONDUCTOR APPARATUS THEREOF
- 专利标题（中）： 冷却板及其半导体装置
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申请号： US12246020申请日： 2008-10-06
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公开(公告)号： US20090211742A1公开(公告)日： 2009-08-27
- 发明人: HELDER LEE , Miriam Schwartz , Michael Kuchar , Aaron Webb , Theodoss Costuros
- 申请人： HELDER LEE , Miriam Schwartz , Michael Kuchar , Aaron Webb , Theodoss Costuros
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： F28F3/12
- IPC分类号： F28F3/12
摘要：
A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.
公开/授权文献
- US09091491B2 Cooling plates and semiconductor apparatus thereof 公开/授权日：2015-07-28
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