发明申请
- 专利标题： ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRONIC DEVICE AND ITS FABRICATION METHOD
- 专利标题（中）： 电子设备基板及其制造方法及其电子设备及其制造方法
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申请号： US12432249申请日： 2009-04-29
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公开(公告)号： US20090211796A1公开(公告)日： 2009-08-27
- 发明人: Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
- 申请人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
- 专利权人： HITACHI CABLE, LTD,NEC ELECTRONICS CORPORATION
- 当前专利权人： HITACHI CABLE, LTD,NEC ELECTRONICS CORPORATION
- 优先权： JP2005-076674 20050317; JP2005-290463 20051003
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
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