A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R2—(R12SiO)nR12Si—R2-A {wherein R1 represents the same or different optionally substituted univalent hydrocarbon groups that do not have unsaturated aliphatic bonds; R2 represents bivalent organic groups; A designates siloxane residual radicals represented by the following average unit formula: (XR12SiO1/2)a (SiO4/2)b (wherein R1 designates the previously mentioned group; X designates a single bond, hydrogen atom, the previously mentioned group that is designated by R1, an epoxy-containing alkyl group, or an alkoxysilylalkyl group; at least one X in one molecule is a single bond; at least two X's are epoxy-containing alkyl groups; “a” is a positive number, “b” is a positive number; and “a/b” is a positive number within the range of 0.2 to 4), and “n” is an integer which is equal to or greater than 1}; and (B) a curing agent for an epoxy resin, is characterized by excellent handlability and curability and that is suitable for curing into a cured body that has excellent flexibility and adhesive characteristics; to provide a highly reliable electronic device.