发明申请
- 专利标题： RESIN COMPOSITION
- 专利标题（中）： 树脂组合物
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申请号： US11915069申请日： 2006-05-17
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公开(公告)号： US20090215968A1公开(公告)日： 2009-08-27
- 发明人: Yasuyuki Kihara , Yoshiki Takahashi , Hidenori Takayama , Masanori Imai , Yasunori Tanaka , Shinji Naruse , David Wayne Anderson
- 申请人： Yasuyuki Kihara , Yoshiki Takahashi , Hidenori Takayama , Masanori Imai , Yasunori Tanaka , Shinji Naruse , David Wayne Anderson
- 申请人地址： JP Sakai-shi, Fukui US DE Wilmington JP Chiyoda-ku, Tokyo
- 专利权人： NITTO SHINKO CORPORATION,E. I. DU PONT DE NEMOURS AND COMPANY,DUPONT TEIJIN ADVANCED PAPERS (JAPAN) LIMITED
- 当前专利权人： NITTO SHINKO CORPORATION,E. I. DU PONT DE NEMOURS AND COMPANY,DUPONT TEIJIN ADVANCED PAPERS (JAPAN) LIMITED
- 当前专利权人地址： JP Sakai-shi, Fukui US DE Wilmington JP Chiyoda-ku, Tokyo
- 优先权： JP2005-148388 20050520
- 国际申请： PCT/JP2006/309855 WO 20060517
- 主分类号： C08L77/06
- IPC分类号： C08L77/06
摘要：
A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.
公开/授权文献
- US07888434B2 Aromatic polyamide and epoxy group-containing phenoxy resin 公开/授权日：2011-02-15