发明申请
US20090218041A1 METHOD FOR MANUFACTURING A PORTABLE ELECTRONIC DEVICE HOUSING 审中-公开
制造便携式电子设备外壳的方法

METHOD FOR MANUFACTURING A PORTABLE ELECTRONIC DEVICE HOUSING
摘要:
A method for forming a housing for an electronic device (510) includes providing a first rigid layer (102, 302) including a curved surface defining a cavity (108, 308). A first adhesive (112, 312) is optionally applied over the curved surface, and an electro-optic module (105, 305) having a flexible substrate and a viewable surface (111, 311), is conformally fitted on the first adhesive (112, 312). A second adhesive (114, 314) is optionally disposed over the electro-optic module (105, 305) and a support structure (122) is optionally placed on the second adhesive (114). The support structure (122) includes an attachment apparatus (126) for mounting electronic circuitry. The first and second adhesives (112, 114) are cured. One of the second adhesive (114) or both the first rigid layer (102, 301) and the first adhesive (112) are transparent for viewing a viewable surface (111, 311) on or coupled to the electro-optic module (105, 305).
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