Invention Application
- Patent Title: METHOD OF FILLING VIAS WITH FUSIBLE METAL
- Patent Title (中): 用可熔金属填充VIAS的方法
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Application No.: US12038891Application Date: 2008-02-28
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Publication No.: US20090218124A1Publication Date: 2009-09-03
- Inventor: JAROSLAW A. MAGERA , BRUCE C. DEEMER
- Applicant: JAROSLAW A. MAGERA , BRUCE C. DEEMER
- Applicant Address: US IL Schaumburg
- Assignee: MOTOROLA, INC.
- Current Assignee: MOTOROLA, INC.
- Current Assignee Address: US IL Schaumburg
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/42
Abstract:
A method is disclosed in which a blind via in a PCB is filled. The vias are plated with a conductor and then with a fusible metal of lower melting point than the conductor. The plated vias are covered with a photoresist and the fusible metal is removed at locations on the PCB other than where the photoresist is disposed. The photoresist is removed and flux is provided on the PCB before the PCB is heated. The heated fusible metal flows into the via.
Information query
