Invention Application
US20090218686A1 SEMICONDUCTOR, SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE, AND MOBILE APPARATUS
有权
半导体器件，半导体器件，制造半导体器件的方法和移动器件
- Patent Title: SEMICONDUCTOR, SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE, AND MOBILE APPARATUS
- Patent Title (中): 半导体器件，半导体器件，制造半导体器件的方法和移动器件
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Application No.: US12394721Application Date: 2009-02-27
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Publication No.: US20090218686A1Publication Date: 2009-09-03
- Inventor: Kouichi SAITOU , Yoshio OKAYAMA , Yasuyuki YANASE , Takahiro FUJII
- Applicant: Kouichi SAITOU , Yoshio OKAYAMA , Yasuyuki YANASE , Takahiro FUJII
- Priority: JP2008-049715 20080229; JP2009-027741 20090209
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/768
Abstract:
A semiconductor module includes a device mounting board and a semiconductor device mounted on the device mounting board. The device mounting board includes an insulating resin layer, a wiring layer provided on one main surface of the insulating resin layer, and bump electrodes, electrically connected to the wiring layer, which are protruded from the wiring layer toward the insulating resin layer. The semiconductor device has device electrodes which are disposed counter to a semiconductor substrate and the bump electrodes, respectively. The surface of a metallic layer provided on the device electrode lies on the same plane as the surface of a protective layer.
Public/Granted literature
Information query
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