公开(公告)号：US08438724B2

公开(公告)日：2013-05-14

申请号：US12900175

申请日：2010-10-07

Applicant: Kouichi Saitou ,  Yoshio Okayama ,  Yoh Takano ,  Mayumi Nakasato

Inventor： Kouichi Saitou ,  Yoshio Okayama ,  Yoh Takano ,  Mayumi Nakasato

IPC: H05K3/30 ,  H01L21/82

CPC classification number: H05K3/4647 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/48 ,  H01L23/49827 ,  H01L23/525 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/4652 ,  H05K2203/0369 ,  Y10T29/4913 ,  Y10T29/49156 ,  H01L2924/00

Abstract: Methods for producing a substrate for mounting a device and for producing a semiconductor module are provided. The methods comprise preparing a metal plate on one major surface of which a plurality of projected electrodes are provided. An insulating resin layer is formed on the major surface so as to cover the top surface of the projected electrodes. The top surface of at least one of the plurality of projected electrodes is exposed by removing the insulating resin layer so that a major surface of the insulating resin layer opposite to the metal plate is level. A plurality of counter electrodes is arranged having a counterface to face the top face of the plurality of projected electrodes or a semiconductor device having a plurality of device electrodes is arranged to face the top face of the plurality of projected electrodes. The at least one of the plurality of projected electrodes, the top surface of which is exposed, is electrically connected with at least one of the plurality of counter electrodes facing the projected electrodes, by pressure-bonding the metal plate with the counter electrode. A wiring layer is formed by selectively removing the metal plate.

Abstract translation: 提供了用于制造用于安装装置的基板和用于制造半导体模块的方法。 所述方法包括在一个主表面上准备金属板，其上设置有多个突起电极。 在主表面上形成绝缘树脂层以覆盖突起电极的顶表面。 通过去除绝缘树脂层使多个突起电极中的至少一个的顶表面暴露，使得与金属板相对的绝缘树脂层的主表面水平。 多个相对电极被布置成具有面对多个突出电极的顶面的相对面，或者具有多个器件电极的半导体器件被布置成面对多个突出电极的顶面。 通过将金属板与对电极压接，多个突出电极中的至少一个突出电极的顶表面被暴露，与多个对置电极中的至少一个面向突出的电极电连接。 通过选择性地去除金属板形成布线层。

公开(公告)号：US20120211269A1

公开(公告)日：2012-08-23

申请号：US13460403

申请日：2012-04-30

Applicant: Kouichi SAITOU ,  Toshiya SHIMIZU

Inventor： Kouichi SAITOU ,  Toshiya SHIMIZU

IPC: H05K1/18 ,  B32B38/10 ,  H05K1/02

CPC classification number: H05K3/38 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0235 ,  H01L2224/02351 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/114 ,  H05K3/381 ,  H05K2201/0355 ,  H05K2201/2072 ,  H05K2203/0369 ,  H05K2203/1152 ,  Y10T156/1039 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A device mounting board includes: an insulating resin layer; a wiring layer formed on one of the principal surfaces of the insulating resin layer; a protection layer covering the insulating resin layer and the wiring layer; a protruding electrode electrically connected to the wiring layer, the protruding electrode protruding from the wiring layer toward the insulating resin layer and penetrating through the insulating resin layer; a wiring-layer-side convex portion protruding from the wiring layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer; and a resin-layer-side convex portion protruding from the protection layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer.

Abstract translation: 装置安装板包括：绝缘树脂层; 形成在绝缘树脂层的一个主表面上的布线层; 覆盖绝缘树脂层和布线层的保护层; 电连接到所述布线层的突出电极，所述突出电极从所述布线层向所述绝缘树脂层突出并且穿过所述绝缘树脂层; 从布线层向绝缘树脂层突出并且其顶端位于绝缘树脂层内部的布线层侧凸部; 以及从保护层朝向绝缘树脂层突出并且其顶端位于绝缘树脂层内部的树脂层侧凸部。

公开(公告)号：US20110027945A1

公开(公告)日：2011-02-03

申请号：US12900175

申请日：2010-10-07

Applicant: Kouichi Saitou ,  Yoshio Okayama ,  Yoh Takano ,  Mayumi Nakasato

Inventor： Kouichi Saitou ,  Yoshio Okayama ,  Yoh Takano ,  Mayumi Nakasato

IPC: H01L21/50 ,  H05K3/02

CPC classification number: H05K3/4647 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/48 ,  H01L23/49827 ,  H01L23/525 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/4652 ,  H05K2203/0369 ,  Y10T29/4913 ,  Y10T29/49156 ,  H01L2924/00

Abstract: A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.

Abstract translation: 用于安装装置的基板包括：绝缘树脂层; 多个突起电极，其电连接到设置在所述绝缘树脂层的一个主表面上的布线层，并且从所述布线层向所述绝缘树脂层突出; 以及设置在与绝缘树脂层的另一个主表面上的多个突出电极中的每一个对应的位置处的对置电极。 在投影电极中，部分投影电极的投影长度小于其他投射电极的投影长度; 并且对应于其的投影电极和对电极电容耦合，并且投影电极和对电极电连接。

公开(公告)号：US07075221B2

公开(公告)日：2006-07-11

申请号：US10636795

申请日：2003-08-07

Applicant: Kouichi Saitou ,  Kazumasa Hirai ,  Tetsuo Asano ,  Kotaro Aoki ,  Yasuo Tanaka

Inventor： Kouichi Saitou ,  Kazumasa Hirai ,  Tetsuo Asano ,  Kotaro Aoki ,  Yasuo Tanaka

IPC: H01J29/86 ,  H01J29/70

CPC classification number: H01J29/861 ,  H01J2229/8606

Abstract: The present invention aims at maintaining the high focusing performance at a low deflection power in a single-beam projection tube which is used as a projection type TV receiver or a projector and is operated at a high voltage and with a high current. The neck outer diameter of a portion on which a deflection yoke is mounted is made smaller than the neck outer diameter of a portion which accommodates an electron gun. The maximum anode voltage of the projection tube is set to equal to or more than 25 kV and the maximum beam current is set to equal to or more than 4 mA

Abstract translation: 本发明旨在在用作投影型TV接收机或投影仪并且以高电流和高电流操作的单束投影管中保持低偏转功率的高聚焦性能。 安装有偏转线圈的部分的颈部外径比容纳电子枪的部分的颈部外径小。 投影管的最大阳极电压被设定为等于或大于25kV，最大光束电流被设定为等于或大于4mA

公开(公告)号：US20140213695A1

公开(公告)日：2014-07-31

申请号：US14238899

申请日：2012-08-31

Applicant: Kouichi Saitou ,  Keiichi Aomatsu ,  Masaki Yanagioka

Inventor： Kouichi Saitou ,  Keiichi Aomatsu ,  Masaki Yanagioka

IPC: C08K7/26

CPC classification number: C08K7/26 ,  B60C1/0016 ,  C08K3/36 ,  C08K2201/002 ,  C08K2201/003 ,  Y02T10/862 ,  C08L21/00

Abstract: An object of the present invention is to provide: a rubber composition which, when it is applied to a component member (such as a tread) of a tire, exhibits good wear resistance without deteriorating rolling resistance of the tire; a cross-linked rubber composition obtained by cross-linking the rubber composition; and a tire using the rubber composition or the cross-linked rubber composition as a material thereof. Specifically, the present invention provides a rubber composition obtained by blending and kneading a rubber component and hydrated silica together, characterized in that: provided that D represents the average primary particle diameter and LP represents the log differential pore volume at a pore diameter of 30 nm, of the hydrated silica in the rubber composition, D and LP satisfy relationships represented by following formulae (1) and (2). LP>−0.045×D+1.45  (1) D

Abstract translation: 本发明的目的在于提供一种橡胶组合物，其在施加到轮胎的构成部件（胎面）时表现出良好的耐磨性，而不会降低轮胎的滚动阻力; 通过交联橡胶组合物得到的交联橡胶组合物; 以及使用橡胶组合物或交联橡胶组合物作为其材料的轮胎。 具体地说，本发明提供了通过将橡胶成分和水合二氧化硅共混并捏合而得到的橡胶组合物，其特征在于：D表示平均一次粒径，LP表示孔径为30nm的对数微分孔体积 的橡胶组合物中的水合二氧化硅，D和LP满足由下式（1）和（2）表示的关系。 LP> -0.045×D + 1.45（1）D <30nm（2）

公开(公告)号：US20140038008A1

公开(公告)日：2014-02-06

申请号：US13983050

申请日：2012-01-11

Applicant: Kouichi Saitou ,  Ryosuke Usui ,  Yoh Takano

Inventor： Kouichi Saitou ,  Ryosuke Usui ,  Yoh Takano

IPC: H01M10/50

CPC classification number: H01M10/647 ,  H01M2/206 ,  H01M10/613

Abstract: A battery cell module includes a plurality of battery cells arranged to each other, bus bars used to connect external terminals of the plurality of battery cells, and separators provided between adjacent battery cells. Each battery cell includes an electrode body, a casing that houses the electrode body, and external terminals, provided external to the casing, which are electrically connected to the electrode body. The separator includes a heat transfer section that performs heat transfer between the heat section and the battery cell and an insulator that electrically insulates between the heat transfer section and the battery cell. The heat transfer section has a thermal conductivity higher than that of the insulator.

Abstract translation: 电池单元模块包括彼此配置的多个电池单元，用于连接多个电池单元的外部端子的汇流条以及设置在相邻电池单元之间的隔板。 每个电池单元包括电极体，容纳电极体的壳体和设置在壳体外部的外部端子，其电连接到电极体。 分离器包括在热部和电池单元之间进行热传递的传热部和在传热部和电池单元之间电绝缘的绝缘体。 传热部的导热系数比绝缘体高。

公开(公告)号：US08237258B2

公开(公告)日：2012-08-07

申请号：US12394721

申请日：2009-02-27

Applicant: Kouichi Saitou ,  Yoshio Okayama ,  Yasuyuki Yanase ,  Takahiro Fujii

Inventor： Kouichi Saitou ,  Yoshio Okayama ,  Yasuyuki Yanase ,  Takahiro Fujii

IPC: H01L23/485

CPC classification number: H01L23/5389 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/12 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/1132 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3511

Abstract: A semiconductor module includes a device mounting board and a semiconductor device mounted on the device mounting board. The device mounting board includes an insulating resin layer, a wiring layer provided on one main surface of the insulating resin layer, and bump electrodes, electrically connected to the wiring layer, which are protruded from the wiring layer toward the insulating resin layer. The semiconductor device has device electrodes which are disposed counter to a semiconductor substrate and the bump electrodes, respectively. The surface of a metallic layer provided on the device electrode lies on the same plane as the surface of a protective layer.

Abstract translation: 半导体模块包括装置安装板和安装在装置安装板上的半导体装置。 装置安装板包括绝缘树脂层，设置在绝缘树脂层的一个主表面上的布线层和从布线层向绝缘树脂层突出的与布线层电连接的凸起电极。 半导体器件具有分别与半导体衬底和凸起电极相对设置的器件电极。 设置在器件电极上的金属层的表面位于与保护层的表面相同的平面上。

公开(公告)号：US20110074021A1

公开(公告)日：2011-03-31

申请号：US12895417

申请日：2010-09-30

Applicant: Mayumi NAKASATO ,  Kouichi Saitou ,  Tetsuya Yamamoto

Inventor： Mayumi NAKASATO ,  Kouichi Saitou ,  Tetsuya Yamamoto

IPC: H01L23/48 ,  H05K1/11

CPC classification number: H05K3/4007 ,  H01L23/49811 ,  H01L24/11 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A device mounting board includes an insulating resin layer, a wiring layer provided on one of main surfaces of the insulating resin layer, and bump electrodes connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A semiconductor module is formed by having the bump electrodes connected to a semiconductor device. A recess is provided in the top face of each bump electrode. The recess communicates with an opening provided on a side surface of the bump electrode.

Abstract translation: 装置安装板包括绝缘树脂层，设置在绝缘树脂层的一个主表面上的布线层以及与布线层电连接并从绝缘树脂层的布线层突出的凸起电极。 通过将凸块电极连接到半导体器件来形成半导体模块。 在每个凸起电极的顶面设置凹部。 凹部与设置在凸块电极的侧面上的开口连通。

公开(公告)号：US4490149A

公开(公告)日：1984-12-25

申请号：US530652

申请日：1983-09-09

Applicant: Kouichi Saitou ,  Shunroku Tohyama ,  Yoshikazu Kosaka

Inventor： Kouichi Saitou ,  Shunroku Tohyama ,  Yoshikazu Kosaka

IPC: C08F8/00 ,  C08F8/44 ,  C08F283/00 ,  C08F283/02 ,  D06P3/54 ,  D06P5/10 ,  D06P5/22 ,  D06P3/00

CPC classification number: D06P5/22 ,  C08F283/02 ,  D06P3/54 ,  D06P5/10 ,  Y10S8/922

Abstract: A process for producing modified polyester products by the graft polymerization of vinyl monomers having an acidic group and replacing the acidic group with an alkali metal salt, the replacing being carried out after dyeing. By this process, decrease in strength and color fastness of polyester fibers can be avoided while giving the polyesters characteristics similar to those of cotton.

Abstract translation: 通过接枝聚合具有酸性基团的乙烯基单体并用碱金属盐代替酸性基团来生产改性聚酯产品的方法，该染色后进行更换。 通过该方法，可以避免聚酯纤维的强度和色牢度的降低，同时使聚酯的特性与棉花相似。

公开(公告)号：US08592257B2

公开(公告)日：2013-11-26

申请号：US13554605

申请日：2012-07-20

Applicant: Mayumi Nakasato ,  Kouichi Saitou

Inventor： Mayumi Nakasato ,  Kouichi Saitou

IPC: H01L21/00

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2221/68336 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/2101 ,  H01L2224/215 ,  H01L2224/2201 ,  H01L2224/221 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00

Abstract: A method for fabricating a semiconductor module includes: bonding a semiconductor substrate onto a first insulating resin layer; dicing the semiconductor substrate into a plurality of individual semiconductor devices; widening the spacings between the adjacent semiconductor devices by expanding the first insulating resin layer in a biaxially stretched manner; fixing the plurality of semiconductor devices to a flat sheet, with a second insulating resin layer held between the plurality of semiconductor devices and the flat sheet, and removing the first insulating resin layer; stacking the plurality of semiconductor devices, a third insulating resin layer, and a metallic plate, in this order, so as to form a laminated body having electrodes by which to electrically connect the device electrodes to the metallic plate; forming a wiring layer by selectively removing the metallic plate and forming a plurality of semiconductor modules; and separating the semiconductor modules into individual units.

Abstract translation: 一种制造半导体模块的方法包括：将半导体衬底接合到第一绝缘树脂层上; 将半导体衬底切割成多个单独的半导体器件; 通过以双向拉伸方式膨胀第一绝缘树脂层来加宽相邻半导体器件之间的间距; 将多个半导体器件固定到平板上，其中第二绝缘树脂层保持在多个半导体器件和平片之间，并且去除第一绝缘树脂层; 依次层叠多个半导体器件，第三绝缘树脂层和金属板，以形成具有电极的层叠体，用于将器件电极与金属板电连接; 通过选择性地去除所述金属板并形成多个半导体模块来形成布线层; 并将半导体模块分离成单独的单元。