Systems, devices and/or methods that facilitate thinner form factors and/or more robust mobile device enclosures by injection molding mobile device enclosures with panels are presented. These panels can include display panels, window panels and touch sensitive panels. Further, panels can be insert molded. Additionally, select panels can be contemporaneously molded by multi-shot injection molding at least a portion of the panel and a portion of the enclosure body. Multi-shot injection molding can include 2-shot injection molding, multi-shot injection molding, and co-injection injection molding. Injection molding a mobile device enclosure with a panel can provide improved form factor mobile device enclosures and/or provide a more robust mobile device enclosure than many traditional methods.