An apparatus for manufacturing wire comprising: a wire delivering equipment, a wire winding equipment, and an annealing while running equipment installed between the wire delivering equipment and the wire winding equipment, the age-precipitation copper alloy wire being passed in such manner that the wire turns around a plurality of times along a running route in the annealing while running equipment. The current applying equipment to raise a temperature of the age-precipitation copper alloy wire by generated Joule heat may be installed at upstream side of the annealing while running equipment. Another current applying equipment for solution treatment may be installed in tandem at upstream side of the annealing while running equipment. In place of the annealing while running equipment, a current applying equipment may be connected in tandem for age-treatment. By using those equipments, age-precipitation copper alloy wire having the diameter of from 0.03 mm to 3 mm may be obtained.