公开(公告)号：US20240376570A1

公开(公告)日：2024-11-14

申请号：US18683272

申请日：2022-08-16

Applicant: LN INDUSTRIES SA

Inventor： Baptiste ROUXEL

IPC: C22C9/00 ,  C22F1/08

Abstract: A copper-titanium alloy includes, by weight, at least 90% copper, from 5 to 7% titanium and from 0.25 to 0.5% iron. It has excellent ductility at the solution-annealed temper and high yield strength after an ageing treatment.

公开(公告)号：US12139783B2

公开(公告)日：2024-11-12

申请号：US17609088

申请日：2020-05-05

Applicant: MATERION CORPORATION

Inventor： John E. Gatehouse ,  Michael J. Gedeon ,  Fritz Grensing ,  Bruce D. Schmeck ,  Jeffrey S. Hoyer ,  Michael F. Tyson ,  Karl R. Ziegler

IPC: C22F1/08 ,  C22C9/00

Abstract: A process for producing a copper-beryllium alloy product. The process comprises preparing a base alloy having 0.15 wt %-4.0 wt % beryllium and having grains and an initial cross section area. The process further comprises cold working the base alloy to a percentage of cold reduction of area (CRA) greater than 40%, based on the initial cross section area, and heat treating the cold worked alloy to produce the copper-beryllium alloy product. The grain structure of the copper-beryllium alloy product has an orientation angle of less than 45° when viewed along the direction of the cold working. The copper-beryllium alloy product demonstrates a fatigue strength of at least 385 MPa after 106 cycles of testing.

公开(公告)号：US12119131B2

公开(公告)日：2024-10-15

申请号：US17397500

申请日：2021-08-09

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  OSAKA UNIVERSITY

Inventor： Jinting Jiu ,  Minoru Ueshima ,  Katsuaki Suganuma ,  Wanli Li

IPC: C22C1/00 ,  C09D11/037 ,  C09D11/52 ,  C22C5/08 ,  C22C9/00 ,  C23C18/08 ,  C23C18/14 ,  H01B1/02

CPC classification number: H01B1/026 ,  C09D11/037 ,  C09D11/52 ,  C22C1/00 ,  C22C5/08 ,  C22C9/00 ,  C23C18/08 ,  C23C18/143

Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

公开(公告)号：US20240336994A1

公开(公告)日：2024-10-10

申请号：US18747526

申请日：2024-06-19

Applicant: HRL Laboratories, LLC

Inventor： John H. MARTIN ,  Julie MILLER ,  Brennan D. YAHATA ,  Jacob M. HUNDLEY

IPC: C22C9/00 ,  B22F9/02 ,  B23K26/342 ,  B33Y10/00 ,  B33Y70/00 ,  C22C5/02 ,  C22C5/06 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  C22C14/00 ,  C22C16/00 ,  C22C18/00 ,  C22C19/03 ,  C22C19/07 ,  C22C21/00 ,  C22C22/00 ,  C22C27/00 ,  C22C27/02 ,  C22C27/04 ,  C22C27/06 ,  C22C28/00 ,  C22C38/00 ,  C22C49/14

CPC classification number: C22C9/00 ,  B22F9/02 ,  B23K26/342 ,  B33Y70/00 ,  C22C5/02 ,  C22C5/06 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  C22C14/00 ,  C22C16/00 ,  C22C18/00 ,  C22C19/03 ,  C22C19/07 ,  C22C21/00 ,  C22C22/00 ,  C22C27/00 ,  C22C27/02 ,  C22C27/04 ,  C22C27/06 ,  C22C28/00 ,  C22C38/00 ,  C22C49/14 ,  B22F2304/10 ,  B33Y10/00

Abstract: Some variations provide a metal-alloy biphasic system containing a first metal M1 and a second metal M2, wherein a second metal phase has a melting temperature lower than that of a first metal phase, and wherein the metal-alloy biphasic system has a hierarchical microstructure containing a second length scale that is at least one order of magnitude smaller than a first length scale. Some variations provide a metal-alloy biphasic system containing a first metal M1 and a second metal M2, wherein a second metal phase has a melting temperature lower than that of a first metal phase, and wherein the first metal phase forms a continuous network. Other variations provide a metal-alloy biphasic powder containing at least a first metal and a second metal, wherein the solubility of first metal in second metal is less than 5%. Methods of making and using the powders and biphasic system are disclosed.

公开(公告)号：US20240254593A1

公开(公告)日：2024-08-01

申请号：US18628786

申请日：2024-04-07

Applicant: CHANGZHOU UNIVERSITY

Inventor： Wei WEI ,  Libo YAO ,  Kunxia WEI ,  Xulong AN ,  Dandan WANG

IPC: C22C9/00 ,  C22F1/08 ,  C25D3/38 ,  C25D5/34 ,  C25D5/50 ,  C25D7/06

CPC classification number: C22C9/00 ,  C22F1/08 ,  C25D3/38 ,  C25D5/34 ,  C25D5/50 ,  C25D7/0614

Abstract: A method for preparing a graphene/copper composite deformed copper-chromium-zirconium alloy layered strip is provided. The method includes: obtaining a deformed copper-chromium-zirconium alloy strip by performing a solid solution treatment on a bulk copper-chromium-zirconium alloy, and performing a room temperature equal channel extrusion and a low temperature rolling on the bulk copper-chromium-zirconium alloy after the solid solution; obtaining a graphene/copper composite deformed copper-chromium-zirconium alloy strip by preparing a graphene/copper composite deposition liquid and performing a surface electrodeposition treatment on the deformed copper-chromium-zirconium alloy strip; obtaining the graphene/copper composite deformed copper-chromium-zirconium alloy layered strip with a rolling deformation of 65%-95% by stacking the graphene/copper composite deformed copper-chromium-zirconium alloy strips for 3-7 layers, and then performing a cold rolling, a single rolling deformation being 5%-10%; and performing a vacuum aging on the graphene/copper composite deformed copper-chromium-zirconium alloy layered strip.

公开(公告)号：US12037671B2

公开(公告)日：2024-07-16

申请号：US17603187

申请日：2020-04-09

Applicant: MATERION CORPORATION

Inventor： Carole L. Trybus ,  John C. Kuli, Jr. ,  Christopher J. Taylor

IPC: C22F1/08 ,  C21D8/02 ,  C22C9/00

CPC classification number: C22F1/08 ,  C21D8/0236 ,  C21D8/0273 ,  C22C9/00

Abstract: A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.

公开(公告)号：US11987870B2

公开(公告)日：2024-05-21

申请号：US17621530

申请日：2020-07-17

Applicant: Sanyo Special Steel Co., Ltd.

Inventor： Tetsuji Kuse ,  Yoshikazu Aikawa ,  Yuichi Nagatomi

IPC: C22C9/00 ,  B22F1/00 ,  B22F1/05 ,  B22F1/06 ,  B22F1/065 ,  C22C9/06

CPC classification number: C22C9/00 ,  B22F1/00 ,  B22F1/05 ,  B22F1/06 ,  B22F1/065 ,  C22C9/06 ,  B22F2301/10 ,  B22F2304/10

Abstract: Provided is a Cu-based alloy powder that is suitable for a process involving rapid melting and rapid solidification and that can provide a shaped object superior in characteristics. The powder is composed of a Cu-based alloy, which contains an element M being one or more elements selected from Cr, Fe, Ni, Zr, and Nb: 0.1% by mass or more and 10.0% by mass or less, Si: more than 0% by mass and 0.20% by mass or less, P: more than 0% by mass and 0.10% by mass or less, and S: more than 0% by mass and 0.10% by mass or less, the balance being Cu and inevitable impurities. This powder has a ratio (D50/TD) of the average particle diameter D50 (μm) thereof to the tap density TD (Mg/m3) is 0.2×10−5·m4/Mg or more and 20×10−5·m4/Mg or less, and has a sphericity of 0.80 or more and 0.95 or less.

公开(公告)号：US11975385B2

公开(公告)日：2024-05-07

申请号：US17700653

申请日：2022-03-22

Applicant: U.S. Army DEVCOM, Army Research Laboratory

Inventor： Kristopher A. Darling ,  Billy C. Hornbuckle ,  Blake P. Fullenwider ,  Albert M. Ostlind ,  Anthony J. Roberts ,  Anit K. Giri

IPC: B22F1/054 ,  B22F1/065 ,  B82Y30/00 ,  B82Y40/00 ,  C22C9/00

CPC classification number: B22F1/054 ,  B22F1/065 ,  B82Y30/00 ,  C22C9/00 ,  B22F2301/10 ,  B82Y40/00

Abstract: A nano-structured alloy material includes a nanoparticle; a matrix phase surrounding the nanoparticle; and an alkali/alkali Earth metal to alter (i) a material property of the nanoparticle, (ii) a material property of the matrix phase, and (iii) an interaction of the nanoparticle with the matrix phase.

公开(公告)号：US20240139804A1

公开(公告)日：2024-05-02

申请号：US18282269

申请日：2022-02-02

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： Mizuki AKIZAWA ,  Hitohiko IDE ,  Takafumi SASAKI

IPC: B22F1/054 ,  B22F9/24 ,  C22C9/00

CPC classification number: B22F1/0551 ,  B22F1/056 ,  B22F9/24 ,  C22C9/00 ,  B22F2301/10 ,  B22F2304/058 ,  B22F2998/10 ,  B22F2999/00

Abstract: Copper particles are provided mainly containing a copper element. In the copper particles, a ratio (S1/B) of a first crystallite size S1 to a particle size B is 0.23 or less, where the first crystallite size is obtained using Scherrer equation from a full width at half maximum of a peak derived from (111) plane of copper in X-ray diffraction measurement, and the particle size is calculated from a BET specific surface area. In the copper particles, a ratio (S1/S2) of the first crystallite size S1 to a second crystallite size S2 is 1.35 or less, where the second crystallite size is obtained using Scherrer equation from a full width at half maximum of a peak derived from (220) plane of copper in X-ray diffraction measurement. A method for manufacturing the copper particles is also provided.

公开(公告)号：US20240124955A1

公开(公告)日：2024-04-18

申请号：US18547409

申请日：2022-02-08

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yosuke NAKASATO ,  Kazunari MAKI ,  Yasuhiro TSUGAWA ,  U TANI

IPC: C22C9/01 ,  B22D11/00 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  C23C14/34 ,  H01J37/34

CPC classification number: C22C9/01 ,  B22D11/004 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  C23C14/3414 ,  H01J37/3426 ,  H01J2237/332

Abstract: This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size μ in a sheet-thickness central portion is 40 μm or less.