发明申请
- 专利标题： Wiring board and method of making the same
- 专利标题（中）： 接线板及其制作方法
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申请号： US12382138申请日： 2009-03-10
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公开(公告)号： US20090229869A1公开(公告)日： 2009-09-17
- 发明人: Toshikazu Harada , Koji Kondo , Atusi Sakaida , Toshihisa Taniguchi , Keiji Okamoto
- 申请人： Toshikazu Harada , Koji Kondo , Atusi Sakaida , Toshihisa Taniguchi , Keiji Okamoto
- 申请人地址： JP Kariya-city
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya-city
- 优先权： JP2008-62759 20080312; JP2008-321428 20081217
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; B32B37/06 ; B29C43/18
摘要：
In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.
公开/授权文献
- US08182729B2 Wiring board and method of making the same 公开/授权日：2012-05-22
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