发明申请
- 专利标题： SEMICONDUCTOR MODULE
- 专利标题（中）： 半导体模块
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申请号： US12046680申请日： 2008-03-12
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公开(公告)号： US20090230535A1公开(公告)日： 2009-09-17
- 发明人: Ralf Otremba , Josef Hoeglauer , Helmut Strack , Xaver Schloegel
- 申请人： Ralf Otremba , Josef Hoeglauer , Helmut Strack , Xaver Schloegel
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L21/50
摘要：
A semiconductor module. In one embodiment, at least two semiconductor chips are placed on a carrier. The at least two semiconductor chips are then covered with a molding material. An exposed portion of the at least two semiconductor chips is provided. A first layer of conductive material is applied over the exposed portion of the at least two semiconductor chips to electrically connect to a contact pad on the exposed portion of the at least two semiconductor chips. The at least two semiconductor chips are singulated.
公开/授权文献
- US08637341B2 Semiconductor module 公开/授权日：2014-01-28
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