发明申请
- 专利标题： SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
- 专利标题（中）： 半导体封装，包括嵌入式芯片
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申请号： US12047028申请日： 2008-03-12
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公开(公告)号： US20090230537A1公开(公告)日： 2009-09-17
- 发明人: Yong Liu , Jeff Ju , Zhongfa Yuan , Roger Luo
- 申请人： Yong Liu , Jeff Ju , Zhongfa Yuan , Roger Luo
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/00
摘要：
A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.
公开/授权文献
- US07768108B2 Semiconductor die package including embedded flip chip 公开/授权日：2010-08-03