发明申请
- 专利标题： SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
- 专利标题（中）： 传感器及其生产方法
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申请号： US12094772申请日： 2006-11-24
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公开(公告)号： US20090236678A1公开(公告)日： 2009-09-24
- 发明人: Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 申请人： Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 优先权： JP2005-341223 20051125; JP2005-371049 20051222; JP2005-371053 20051222; JP2006-089558 20060328
- 国际申请： PCT/JP2006/323455 WO 20061124
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L21/50
摘要：
A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.
公开/授权文献
- US08026594B2 Sensor device and production method therefor 公开/授权日：2011-09-27
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