Invention Application
- Patent Title: HIGH FREQUENCY POWER AMPLIFIER
- Patent Title (中): 高频功率放大器
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Application No.: US12147542Application Date: 2008-06-27
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Publication No.: US20090237166A1Publication Date: 2009-09-24
- Inventor: Seiki Gotou , Akira Inoue , Ko Kanaya , Shinsuke Watanabe
- Applicant: Seiki Gotou , Akira Inoue , Ko Kanaya , Shinsuke Watanabe
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2008-073931 20080321
- Main IPC: H03F3/191
- IPC: H03F3/191 ; H03F3/68

Abstract:
A high frequency power amplifier comprises: a multi-finger transistor with transistor cells electrically connected in parallel; an input side matching circuit connected to gate electrodes of the transistor cells; and resonant circuits respectively connected between the gate electrode of a transistor cell and the input side matching circuit. The resonant circuit resonates at a second harmonic of the operating frequency of the transistor or within a predetermined range of frequencies having a center at the second harmonic of the operating frequency, and becomes a high-impedance load at the second harmonic, or an open load.
Public/Granted literature
- US07777571B2 High frequency power amplifier Public/Granted day:2010-08-17
Information query
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