发明申请
US20090239091A1 METHOD FOR PRINTING A METAL PASTE, METAL MASK, AND BUMP FORMING METHOD 审中-公开
印刷金属膏,金属掩模和防爆形成方法

  • 专利标题: METHOD FOR PRINTING A METAL PASTE, METAL MASK, AND BUMP FORMING METHOD
  • 专利标题(中): 印刷金属膏,金属掩模和防爆形成方法
  • 申请号: US12394595
    申请日: 2009-02-27
  • 公开(公告)号: US20090239091A1
    公开(公告)日: 2009-09-24
  • 发明人: Masaaki Abe
  • 申请人: Masaaki Abe
  • 申请人地址: JP Kanagawa
  • 专利权人: NEC ELECTRONICS CORPORATION
  • 当前专利权人: NEC ELECTRONICS CORPORATION
  • 当前专利权人地址: JP Kanagawa
  • 优先权: JP2008-069324 20080318
  • 主分类号: B32B15/02
  • IPC分类号: B32B15/02 B05D5/12
METHOD FOR PRINTING A METAL PASTE, METAL MASK, AND BUMP FORMING METHOD
摘要:
A method for printing a metal paste includes the step of arranging, to locate a through hole of a metal mask having the through hole on an electrode, a metal mask on a substrate and forming a gap portion communicating with the through hole in an interface between the substrate and the metal mask. According to this method, in filling of a metal paste, a flux oozing on a surface of the metal paste can be moved to the gap portion. In other words, a deaeration path for residual air in the metal paste clogged by the flux can be secured by removing the flux. In this manner, in the through hole, the remaining air in the metal paste can be removed, and a filling rate of the metal paste can be increased.
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