发明申请
US20090239992A1 THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
审中-公开
热固性树脂组合物和包含其的固化膜
- 专利标题： THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
- 专利标题（中）： 热固性树脂组合物和包含其的固化膜
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申请号： US12309979申请日： 2007-08-08
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公开(公告)号： US20090239992A1公开(公告)日： 2009-09-24
- 发明人: Toshiaki Yamada , Hidenori Iida , Yasukazu Anbai , Shin Teraki , Masaki Yoshida , Satoko Takahashi
- 申请人： Toshiaki Yamada , Hidenori Iida , Yasukazu Anbai , Shin Teraki , Masaki Yoshida , Satoko Takahashi
- 优先权： JP2006-215464 20060808
- 国际申请： PCT/JP2007/065484 WO 20070808
- 主分类号： A61K8/33
- IPC分类号： A61K8/33 ; C08G61/10
摘要：
To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.