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1.
公开(公告)号:US20090239992A1
公开(公告)日:2009-09-24
申请号:US12309979
申请日:2007-08-08
申请人: Toshiaki Yamada , Hidenori Iida , Yasukazu Anbai , Shin Teraki , Masaki Yoshida , Satoko Takahashi
发明人: Toshiaki Yamada , Hidenori Iida , Yasukazu Anbai , Shin Teraki , Masaki Yoshida , Satoko Takahashi
CPC分类号: C08F299/00 , C08F299/02 , C08L51/006 , C08L53/02 , C08L53/025 , H01B3/28 , H01B3/441 , H01B3/442 , H05K1/024 , H05K3/4626 , H05K3/4676 , C08L2666/02
摘要: To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.
摘要翻译: 为了提供一种具有优异的成膜性能的热固性树脂组合物,其可以形成具有低弹性模量并且在高频范围内具有低介电常数和低介电损耗角正切的固化产物; 和包含(A)由通式(1)表示的乙烯基化合物和(B)橡胶和/或热塑性弹性体)的热固性树脂组合物。
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公开(公告)号:US20090020779A1
公开(公告)日:2009-01-22
申请号:US12215281
申请日:2008-06-26
CPC分类号: H01L33/52 , B29C43/146 , B29C43/18 , B29C2043/3644 , B29K2101/10 , B29K2105/256 , H01L24/97 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00
摘要: A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film.
摘要翻译: 一种用于制造发光二极管芯片封装产品的方法,所述方法包括用热固性膜覆盖连接到基板上的发光二极管芯片,并热固化所述热固性膜。
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3.
公开(公告)号:US5968124A
公开(公告)日:1999-10-19
申请号:US744755
申请日:1996-11-06
申请人: Satoko Takahashi , Yoshihiro Oda , Shizuo Nara , Takashi Imai
发明人: Satoko Takahashi , Yoshihiro Oda , Shizuo Nara , Takashi Imai
IPC分类号: G06F13/00 , H04L12/24 , G06F15/177
摘要: Operation of a network which comprises a plurality of mutually connected subordinate-networks is performed. Operation information is unitarily managed transmitted and received in the entirety of the network. An information storing unit stores operation management information used for the network operation management. A communications unit transmits and receives the operation information. Control is performed so that when the operation information is received from a subordinate-network, updating processing is performed if the contents of the operation information should be affected in the operation management information, and, operation information for reporting is produced and distributed to needing subordinate-networks based on the operation management information if reporting processing should be performed.
摘要翻译: 执行包括多个相互连接的从属网络的网络的操作。 在整个网络中传送和接收操作信息。 信息存储单元存储用于网络操作管理的操作管理信息。 通信单元发送和接收操作信息。 执行控制,使得当从下级网络接收到操作信息时,如果在操作管理信息中影响操作信息的内容,则执行更新处理,并且生成用于报告的操作信息并分发给需要的从属 - 如果应该执行报告处理,则基于操作管理信息的网络。
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公开(公告)号:US07932108B2
公开(公告)日:2011-04-26
申请号:US12215281
申请日:2008-06-26
IPC分类号: H01L21/00
CPC分类号: H01L33/52 , B29C43/146 , B29C43/18 , B29C2043/3644 , B29K2101/10 , B29K2105/256 , H01L24/97 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00
摘要: A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film.
摘要翻译: 一种用于制造发光二极管芯片封装产品的方法,所述方法包括用热固性膜覆盖连接到基板上的发光二极管芯片,并热固化所述热固性膜。
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