发明申请
- 专利标题： MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE
- 专利标题（中）： 具有基板的可集成集成电路封装系统
-
申请号： US12054701申请日： 2008-03-25
-
公开(公告)号： US20090243067A1公开(公告)日： 2009-10-01
- 发明人: Zigmund Ramirez Camacho , Abelardo Jr. Advincula , Henry Descalzo Bathan , Lionel Chien Hui Tay
- 申请人： Zigmund Ramirez Camacho , Abelardo Jr. Advincula , Henry Descalzo Bathan , Lionel Chien Hui Tay
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/58
摘要：
A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting the external leadfinger and the substrate.
公开/授权文献
- US07855444B2 Mountable integrated circuit package system with substrate 公开/授权日：2010-12-21
信息查询
IPC分类:
