发明申请
- 专利标题: Heat-dissipating module
- 专利标题(中): 散热模块
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申请号: US12213247申请日: 2008-06-17
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公开(公告)号: US20090244844A1公开(公告)日: 2009-10-01
- 发明人: Chin-Chun Liao , Meng-Hung Ko
- 申请人: Chin-Chun Liao , Meng-Hung Ko
- 申请人地址: TW Taipei City
- 专利权人: TAI-SOL ELECTRONICS CO., LTD.
- 当前专利权人: TAI-SOL ELECTRONICS CO., LTD.
- 当前专利权人地址: TW Taipei City
- 优先权: TW97205587 20080401
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A heat-dissipating module includes a heat sink, a plurality of fixtures, and a plurality of fasteners. The heat sink includes a plurality of fins and a plurality of hollowed portions located at a periphery thereof. Each of the fixtures includes a support portion and two lap joint portions. Each of the two lap joint portions has a fasten hole. Each of the support portions has a support hole. Each of the fixtures corresponds to one of the hollowed portions. The two lap joint portions of each fixture are mounted to a top edge of the fins and close to two sides of the support portion. The fasteners fasten the lap joint portions to the heat sink. In this way, the heat sink and the fixtures are fastened with each other to enhance the structural durability of the heat-dissipating module. In addition, the heat-dissipating module is small-sized, taking less space.
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