发明申请
US20090244848A1 Power Device Substrates and Power Device Packages Including the Same
审中-公开
电源设备基板和包括其的电源设备包
- 专利标题: Power Device Substrates and Power Device Packages Including the Same
- 专利标题(中): 电源设备基板和包括其的电源设备包
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申请号: US12336437申请日: 2008-12-16
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公开(公告)号: US20090244848A1公开(公告)日: 2009-10-01
- 发明人: Seung-won Lim , O-soeb Jeon , Seung-yong Choi , Joon-seo Son , Man-kyo Jong
- 申请人: Seung-won Lim , O-soeb Jeon , Seung-yong Choi , Joon-seo Son , Man-kyo Jong
- 优先权: KR10-2008-0029312 20080328
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
Provided are power device substrates that comprise thermally conductive plastic materials, and power device packages including the same. An exemplary power device package includes a power device substrate that comprises a thermally conductive plastic material, and has a first principal plane that provides an electrically insulating surface and a second principal plane of which at least a portion is exposed outside a molding member. The exemplary power device package further includes one or more power devices disposed on the first principal plane of the power device substrate, and a plurality of conductive members that are electrically connected to the power device(s) in order to electrically connect the power device(s) to an external circuit.