发明申请
- 专利标题： MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS USING THEREOF
- 专利标题（中）： 半导体器件的安装结构及其使用的电子设备
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申请号： US12411884申请日： 2009-03-26
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公开(公告)号： US20090244860A1公开(公告)日： 2009-10-01
- 发明人: Shinji Watanabe , Takao Yamazaki
- 申请人： Shinji Watanabe , Takao Yamazaki
- 申请人地址： JP Tokyo
- 专利权人： NEC CORPORATION
- 当前专利权人： NEC CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-080372 20080326
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01R12/24 ; H01L25/16
摘要：
A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.
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