发明申请
US20090250681A1 Non-Volatile Resistive Oxide Memory Cells, Non-Volatile Resistive Oxide Memory Arrays, And Methods Of Forming Non-Volatile Resistive Oxide Memory Cells And Memory Arrays 有权
非易失性电阻氧化物记忆单元,非易失性电阻氧化物存储器阵列以及形成非易失性电阻氧化物记忆单元和存储器阵列的方法

  • 专利标题: Non-Volatile Resistive Oxide Memory Cells, Non-Volatile Resistive Oxide Memory Arrays, And Methods Of Forming Non-Volatile Resistive Oxide Memory Cells And Memory Arrays
  • 专利标题(中): 非易失性电阻氧化物记忆单元,非易失性电阻氧化物存储器阵列以及形成非易失性电阻氧化物记忆单元和存储器阵列的方法
  • 申请号: US12099267
    申请日: 2008-04-08
  • 公开(公告)号: US20090250681A1
    公开(公告)日: 2009-10-08
  • 发明人: John SmytheBhaskar SrinivasanGurtej Sandhu
  • 申请人: John SmytheBhaskar SrinivasanGurtej Sandhu
  • 主分类号: H01L45/00
  • IPC分类号: H01L45/00
Non-Volatile Resistive Oxide Memory Cells, Non-Volatile Resistive Oxide Memory Arrays, And Methods Of Forming Non-Volatile Resistive Oxide Memory Cells And Memory Arrays
摘要:
A method of forming a non-volatile resistive oxide memory cell includes forming a first conductive electrode of the memory cell as part of a substrate. Insulative material is deposited over the first electrode. An opening is formed into the insulative material over the first electrode. The opening includes sidewalls and a base. The opening sidewalls and base are lined with a multi-resistive state layer comprising multi-resistive state metal oxide-comprising material which less than fills the opening. A second conductive electrode of the memory cell is formed within the opening laterally inward of the multi-resistive state layer lining the sidewalls and elevationally over the multi-resistive state layer lining the base. Other aspects and implementations are contemplated.
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