发明申请
US20090251271A1 Structure For A Wiring Assembly And Method Suitable For Forming Multiple Coil Rows With Splice Free Conductor 有权
适用于使用无接头导体形成多个线圈的接线组件和方法的结构

  • 专利标题: Structure For A Wiring Assembly And Method Suitable For Forming Multiple Coil Rows With Splice Free Conductor
  • 专利标题(中): 适用于使用无接头导体形成多个线圈的接线组件和方法的结构
  • 申请号: US12061870
    申请日: 2008-04-03
  • 公开(公告)号: US20090251271A1
    公开(公告)日: 2009-10-08
  • 发明人: Gerald StelzerRainer MeinkePaul Bruton
  • 申请人: Gerald StelzerRainer MeinkePaul Bruton
  • 主分类号: H01F27/30
  • IPC分类号: H01F27/30 H01F7/06
Structure For A Wiring Assembly And Method Suitable For Forming Multiple Coil Rows With Splice Free Conductor
摘要:
A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method includes forming a structure comprising layers of material extending along a first aperture path. The structure includes multiple concentric layer surfaces. A channel is formed in each of the layers of the material and along each of the multiple surfaces. Conductive material is positioned in each channel to provide a spiral configuration. The surfaces of multiple ones of the layers are of tubular shape. The layers of material are sequentially positioned one over another and about an axis along which first and second opposing coil end regions are formed. The layers are formed with a region of a first thickness and a shoulder region. The shoulder region is alternately formed in the sequence at one coil end region or at the other coil end region. Each shoulder region has a greater thickness than the first thickness.
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