发明申请
- 专利标题： Electronic device packages and methods of formation
- 专利标题（中）： 电子器件封装和形成方法
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申请号： US12072157申请日： 2008-02-25
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公开(公告)号： US20090256251A1公开(公告)日： 2009-10-15
- 发明人: James W. Getz , David W. Sherrer , John J. Fisher
- 申请人： James W. Getz , David W. Sherrer , John J. Fisher
- 申请人地址： US MA Marlborough
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人地址： US MA Marlborough
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L21/50
摘要：
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
公开/授权文献
- US08203207B2 Electronic device packages and methods of formation 公开/授权日：2012-06-19
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