发明申请
US20090258161A1 Circuitized substrate with P-aramid dielectric layers and method of making same
审中-公开
具有P型芳族聚酰胺介电层的电路基板及其制造方法
- 专利标题： Circuitized substrate with P-aramid dielectric layers and method of making same
- 专利标题（中）： 具有P型芳族聚酰胺介电层的电路基板及其制造方法
-
申请号： US12380637申请日： 2009-03-02
-
公开(公告)号： US20090258161A1公开(公告)日： 2009-10-15
- 发明人: Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
- 申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
- 主分类号： B05D5/12
- IPC分类号： B05D5/12 ; B05D3/06
摘要：
A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.
公开/授权文献
- US2209828A Thermal insulating article and assembly 公开/授权日：1940-07-30