发明申请
- 专利标题： METHOD OF FORMING MEASURING TARGETS FOR MEASURING DIMENSIONS OF SUBSTRATE IN SUBSTRATE MANUFACTURING PROCESS
- 专利标题（中）： 形成测量靶材的方法，用于测量基板制造工艺中的基板尺寸
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申请号： US12136292申请日： 2008-06-10
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公开(公告)号： US20090258320A1公开(公告)日： 2009-10-15
- 发明人: Hsiang-Ming Feng
- 申请人： Hsiang-Ming Feng
- 申请人地址： TW Kaoshiung
- 专利权人： ASE Electronics Inc.
- 当前专利权人： ASE Electronics Inc.
- 当前专利权人地址： TW Kaoshiung
- 优先权： TW97113049 20080410
- 主分类号： G03F7/20
- IPC分类号： G03F7/20
摘要：
A method of forming measuring targets for measuring the dimensions of a substrate during a substrate manufacturing process is provided. First, a board having a base layer and a conductive layer is provided, wherein the conductive layer is disposed on a surface of the base layer. Then, at least one through hole is formed in the board as a measuring target for measuring the dimensions of the substrate. Next, a plated via is formed in the through hole as another measuring target for measuring the dimensions of the substrate. Thereafter, a patterned dielectric layer is formed on the board to expose the plated via as a next measuring target for measuring the dimensions of the substrate. In the present invention, measuring targets are formed during a substrate manufacturing process and the dimensions of the substrate are measured instantly. The accuracy in process alignment is improved without increasing the fabrication cost.
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