发明申请
- 专利标题: STT MRAM Magnetic Tunnel Junction Architecture and Integration
- 专利标题(中): STT MRAM磁隧道结结构与集成
-
申请号: US12355941申请日: 2009-01-19
-
公开(公告)号: US20090261434A1公开(公告)日: 2009-10-22
- 发明人: Seung H. Kang , Xia Li , Shiqun Gu , Kangho Lee , Xiaochun Zhu
- 申请人: Seung H. Kang , Xia Li , Shiqun Gu , Kangho Lee , Xiaochun Zhu
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM INCORPORATED
- 当前专利权人: QUALCOMM INCORPORATED
- 当前专利权人地址: US CA San Diego
- 主分类号: H01L29/82
- IPC分类号: H01L29/82 ; H01L21/00
摘要:
A magnetic tunnel junction (MTJ) device for a magnetic random access memory (MRAM) in a semiconductor back-end-of-line (BEOL) process flow includes a first metal interconnect for communicating with at least one control device and a first electrode for coupling to the first metal interconnect through a via formed in a dielectric passivation barrier using a first mask. The device also includes an MTJ stack for storing data coupled to the first electrode, a portion of the MTJ stack having lateral dimensions based upon a second mask. The portion defined by the second mask is over the contact via. A second electrode is coupled to the MTJ stack and also has a same lateral dimension as defined by the second mask. The first electrode and a portion of the MTJ stack are defined by a third mask. A second metal interconnect is coupled to the second electrode and at least one other control device.
公开/授权文献
信息查询
IPC分类: