发明申请
- 专利标题： Substrate Processing Apparatus
- 专利标题（中）： 基板加工装置
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申请号： US12242296申请日： 2008-09-30
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公开(公告)号： US20090269936A1公开(公告)日： 2009-10-29
- 发明人: Osamu Tamada , Masakazu Sanada , Tadashi Miyagi
- 申请人： Osamu Tamada , Masakazu Sanada , Tadashi Miyagi
- 申请人地址： JP Kyoto
- 专利权人： Sokudo Co., Ltd.
- 当前专利权人： Sokudo Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 优先权： JPJP2007-258693 20071002
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; B05B12/04
摘要：
A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.
公开/授权文献
- US08286576B2 Substrate processing apparatus 公开/授权日：2012-10-16
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