Substrate processing apparatus
    1.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US08286576B2

    公开(公告)日:2012-10-16

    申请号:US12242296

    申请日:2008-09-30

    CPC分类号: H01L21/6715 G03F7/16

    摘要: A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.

    摘要翻译: 用于防反射膜的热处理器的热处理单元包括:覆盖喷嘴,用于从由热处理板支撑的上方覆盖基板,并将粘附增强剂排放到由热处理板支撑的基板的周边; 以及用于将气相中的粘附增强剂供给到覆盖喷嘴的蒸发处理器。 当放置在热处理板上的基板经受热处理时,控制部分使得覆盖喷嘴将气相中的粘附增强剂排出到基板的周边上,以实现粘附增强过程。 因此,增强了抗蚀剂涂膜与基板周边的基板表面之间的粘合性。 此外,热处理和附着增强过程的并行实施对生产量没有影响。

    Substrate Processing Apparatus
    2.
    发明申请
    Substrate Processing Apparatus 有权
    基板加工装置

    公开(公告)号:US20090269936A1

    公开(公告)日:2009-10-29

    申请号:US12242296

    申请日:2008-09-30

    IPC分类号: H01L21/302 B05B12/04

    CPC分类号: H01L21/6715 G03F7/16

    摘要: A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.

    摘要翻译: 用于防反射膜的热处理器的热处理单元包括:覆盖喷嘴,用于从由热处理板支撑的上方覆盖基板,并将粘附增强剂排放到由热处理板支撑的基板的周边; 以及用于将气相中的粘附增强剂供给到覆盖喷嘴的蒸发处理器。 当放置在热处理板上的基板经受热处理时,控制部分使得覆盖喷嘴将气相中的粘附增强剂排出到基板的周边上,以实现粘附增强过程。 因此,增强了抗蚀剂涂膜与基板周边的基板表面之间的粘合性。 此外,热处理和附着增强过程的并行实施对生产量没有影响。

    APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
    3.
    发明申请
    APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE 审中-公开
    装置和处理基板的方法

    公开(公告)号:US20090070946A1

    公开(公告)日:2009-03-19

    申请号:US12211549

    申请日:2008-09-16

    IPC分类号: B08B3/04 B08B3/12

    摘要: A cleaning processing part including an edge cleaning processing unit for cleaning an edge of a substrate is provided in an indexer block. An indexer robot provided in the indexer block transports an unprocessed substrate taken out of a cassette to the cleaning processing part before transporting the unprocessed substrate to an anti-reflection film processing block serving as a processor. The cleaning processing part cleans an edge and a back surface of a substrate.

    摘要翻译: 在分度块中设置有包括用于清洁基板的边缘的边缘清洁处理单元的清洁处理部。 设置在分度器块中的分度器机器人将将未处理的基板输送到用作处理器的防反射膜处理块之前,将从盒中取出的未处理基板输送到清洁处理部。 清洁处理部件清洁基板的边缘和背面。

    MULTI-SPEED SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    4.
    发明申请
    MULTI-SPEED SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    多速基板加工设备和基板处理方法

    公开(公告)号:US20090071940A1

    公开(公告)日:2009-03-19

    申请号:US12208992

    申请日:2008-09-11

    IPC分类号: C23F1/00 C23F1/08

    摘要: After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is increased. The increase in the rotational speed of the substrate causes a centrifugal force to be slightly greater than tension, thereby causing the liquid layer to be held on the substrate with the thickness thereof in its peripheral portion increased and the thickness thereof at the center thereof decreased. Then, gas is discharged toward the center of the liquid layer from a gas supply nozzle, so that a hole is formed at the center of the liquid layer. This causes tension that is balanced with a centrifugal force exerted on the peripheral portion of the liquid layer to disappear. Furthermore, the rotational speed of the substrate is further increased while the gas is discharged. Thus, the liquid layer moves outward from the substrate.

    摘要翻译: 在用冲洗液冲洗衬底上的显影液后,减小基片的旋转速度,从而在衬底的顶表面上形成漂洗液体的液体层。 此后,基板的旋转速度增加。 基板的旋转速度的增加使离心力略大于张力,从而使液体层保持在基板的周边部分的厚度增加,其中心部的厚度减小。 然后,气体从气体供给喷嘴向液体中心排出,从而在液体层的中心形成有孔。 这导致张力被平衡,施加在液体层的周边部分上的离心力消失。 此外,在排出气体的同时,基板的旋转速度进一步提高。 因此,液体层从基板向外移动。

    SUBSTRATE PROCESSING APPARATUS WITH MULTI-SPEED DRYING
    5.
    发明申请
    SUBSTRATE PROCESSING APPARATUS WITH MULTI-SPEED DRYING 有权
    具有多速干燥的基板加工装置

    公开(公告)号:US20090073394A1

    公开(公告)日:2009-03-19

    申请号:US12208925

    申请日:2008-09-11

    IPC分类号: G03B27/32 B08B13/00

    摘要: After a substrate is cleaned, a liquid supply nozzle moves outward from above the center of the substrate while discharging a rinse liquid with the substrate rotated. In this case, a drying region where no rinse liquid exists expands on the substrate. When the liquid supply nozzle moves to above a peripheral portion of the substrate, the rotational speed of the substrate is reduced. The movement speed of the liquid supply nozzle is maintained as it is. Thereafter, the discharge of the rinse liquid is stopped while the liquid supply nozzle moves outward from the substrate. Thus, the drying region spreads over the whole substrate so that the substrate is dried.

    摘要翻译: 在清洁基板之后,液体供应喷嘴从衬底的中心向外移动,同时在衬底旋转的同时排出冲洗液体。 在这种情况下,不存在冲洗液的干燥区域在基板上膨胀。 当液体供给喷嘴移动到基板的周边部分上方时,基板的旋转速度降低。 液体供应喷嘴的运动速度保持原样。 此后,在液体供给喷嘴从基板向外移动的同时停止冲洗液的排出。 因此,干燥区域遍及整个基板,使得基板被干燥。

    Substrate processing apparatus and substrate processing method
    7.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US08894775B2

    公开(公告)日:2014-11-25

    申请号:US12209039

    申请日:2008-09-11

    IPC分类号: B08B3/04 H01L21/67

    CPC分类号: H01L21/67051

    摘要: After a substrate is cleaned, a liquid layer of a rinse liquid is formed so as to cover one surface of the substrate. Then, a liquid supply nozzle moves outward from above the center of the substrate. The liquid supply nozzle is stopped once at the time point where it moves by a predetermined distance from above the center of the substrate. In this time period, the liquid layer is divided within a thin layer region by a centrifugal force, so that a drying core is formed at the center of the liquid layer. Thereafter, the liquid supply nozzle moves outward again, so that a drying region where no rinse liquid exists expands on the substrate with the drying core as its starting point.

    摘要翻译: 在清洁基板之后,形成冲洗液体的液体层以覆盖基板的一个表面。 然后,液体供给喷嘴从基板的中心的上方向外侧移动。 液体供给喷嘴在从基板的中心上方移动预定距离的时间点停止一次。 在该时间段内,通过离心力将液体层分割成薄层区域,从而在液体层的中央形成干燥芯。 此后,液体供给喷嘴再次向外移动,使得在干燥芯作为起点的基板上不存在冲洗液体的干燥区域膨胀。

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    9.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号:US20090074402A1

    公开(公告)日:2009-03-19

    申请号:US12209039

    申请日:2008-09-11

    IPC分类号: G03D5/00

    CPC分类号: H01L21/67051

    摘要: After a substrate is cleaned, a liquid layer of a rinse liquid is formed so as to cover one surface of the substrate. Then, a liquid supply nozzle moves outward from above the center of the substrate. The liquid supply nozzle is stopped once at the time point where it moves by a predetermined distance from above the center of the substrate. In this time period, the liquid layer is divided within a thin layer region by a centrifugal force, so that a drying core is formed at the center of the liquid layer. Thereafter, the liquid supply nozzle moves outward again, so that a drying region where no rinse liquid exists expands on the substrate with the drying core as its starting point.

    摘要翻译: 在清洁基板之后,形成冲洗液体的液体层以覆盖基板的一个表面。 然后,液体供给喷嘴从基板的中心的上方向外侧移动。 液体供给喷嘴在从基板的中心上方移动预定距离的时间点停止一次。 在该时间段内,通过离心力将液体层分割成薄层区域,从而在液体层的中央形成干燥芯。 此后,液体供给喷嘴再次向外移动,使得在干燥芯作为起点的基板上不存在冲洗液体的干燥区域膨胀。

    Substrate processing method
    10.
    发明授权
    Substrate processing method 有权
    基板加工方法

    公开(公告)号:US08540824B2

    公开(公告)日:2013-09-24

    申请号:US12813251

    申请日:2010-06-10

    摘要: The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

    摘要翻译: 在清洁/干燥处理组中的清洁/干燥处理单元中的基板的清洁和干燥处理到在热处理组中的曝光后烘烤(PEB)的后处理组中的曝光后烘烤处理的传送过程, 干燥处理块如下所述。 首先,在清洗/干燥处理组中对曝光处理后的基板进行清洗干燥处理后,第六中央机器人从清洗/干燥处理组中取出基板,将该基板搬送到热处理组中 - 在清洁/干燥处理块中进行曝光烘烤。