发明申请
- 专利标题： Temperature responsive depsipeptide polymer
- 专利标题（中）： 温度反应性三肽聚合物
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申请号： US11665864申请日： 2005-10-20
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公开(公告)号： US20090275730A1公开(公告)日： 2009-11-05
- 发明人: Hiroyuki Oku , Kazuaki Shichiri , Tomohiro Taira , Aya Inoue , Keiichi Yamada , Ryoichi Katakai
- 申请人： Hiroyuki Oku , Kazuaki Shichiri , Tomohiro Taira , Aya Inoue , Keiichi Yamada , Ryoichi Katakai
- 优先权： JP2004-305953 20041020
- 国际申请： PCT/JP05/19332 WO 20051020
- 主分类号： C07K7/08
- IPC分类号： C07K7/08 ; C07K7/06
摘要：
There is provided a temperature responsive polymer compound which comprises a repeating unit represented by the following general formula (I): —R1-Hmb-R2— (I) where, Hmb represents a valic acid residue represented by the following formula (II); R1 represents an amino acid, a polypeptide, or a hydroxy acid being linked by ester bond; R2 represents an amino acid or a polypeptide being linked by amide bond or a hydroxy acid being linked by ester bond: and wherein said polymer compound has 18 or more of amino acids residues and hydroxy acid residues in total.