发明申请
- 专利标题： Substrate With HF-Compatible Line
- 专利标题（中）： 基板与HF兼容线
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申请号： US12412150申请日： 2009-03-26
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公开(公告)号： US20090278630A1公开(公告)日： 2009-11-12
- 发明人: Robert Koch , Maximilian Pitschi , Juergen Kiwitt
- 申请人： Robert Koch , Maximilian Pitschi , Juergen Kiwitt
- 优先权： DE102006047427.9 20061006
- 主分类号： H01P3/08
- IPC分类号： H01P3/08
摘要：
A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.
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