发明申请
- 专利标题： METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE
- 专利标题（中）： 将集成电路芯片连接到模块的方法
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申请号： US12118145申请日： 2008-05-09
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公开(公告)号： US20090279275A1公开(公告)日： 2009-11-12
- 发明人: Stephen Peter Ayotte , David J. Hill , Timothy M. Sullivan
- 申请人： Stephen Peter Ayotte , David J. Hill , Timothy M. Sullivan
- 主分类号： H05K7/02
- IPC分类号： H05K7/02 ; H01L21/60
摘要：
A method of attaching an integrated circuit chip to a module and a resultant structure. The method includes placing a solder bump tape between the chip and the module, the solder bump tape including an array of solder columns embedded in a dielectric sheet; aligning and contacting top surfaces of solder columns with respective chip pads of an array of chip pads of the chip and aligning and contacting bottom surfaces of the solder columns with respective module pads of an array of module pads; and reflowing the solder columns to form solder interconnections between chip pads and respective module pads.
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