发明申请
US20090283761A1 METHOD OF CUTTING SINGLE CRYSTALS 有权
切割单晶的方法

METHOD OF CUTTING SINGLE CRYSTALS
摘要:
A method of dividing single crystals, particularly of plates of parts thereof, is proposed, which can comprise: pre-adjusting the crystallographic cleavage plane (2′) relative to the cleavage device, setting a tensional intensity (K) by means of tensional fields (3′, 4′), determining an energy release rate G(α) in dependence from a possible deflection angle (α) from the cleavage plane (2′) upon crack propagation, controlling the tensional fields (3′, 4′) such that the crack further propagates in the single crystal, wherein G(0)≧2γe(0) and simultaneously at least one of the following conditions is satisfied:  ∂ G ∂ α  α = 0 ≤ 2  β e h   if   ∂ 2  G ∂ α 2 ≤ 0   or ( 2.1 )  ∂ G ∂ α  ≤ 2  β e h  ∀ α  :  α 1
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