Invention Application
- Patent Title: Package structure and method
- Patent Title (中): 包装结构和方法
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Application No.: US12453405Application Date: 2009-05-11
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Publication No.: US20090283896A1Publication Date: 2009-11-19
- Inventor: Yu-Lin Yang
- Applicant: Yu-Lin Yang
- Priority: TW097117612 20080513
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/98 ; H01L21/56
Abstract:
A semiconductor die has a surface and an active region on the surface. A thick-film coating is applied to the surface of the semiconductor die to cover only a portion or entire of the active region before the semiconductor die is cut from a wafer. The thick-film coating reduces the stress to the semiconductor die. The thick-film coating does not cover the bonding pads of the semiconductor die to avoid influencing the bonding wires bonding to the boding pads.
Information query
IPC分类:
