Invention Application
- Patent Title: PHASE CHANGE MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME
- Patent Title (中): 相变存储器件及其制造方法
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Application No.: US12325067Application Date: 2008-11-28
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Publication No.: US20090294750A1Publication Date: 2009-12-03
- Inventor: Jen-Chi Chuang , Yung-Fa Lin , Ming-Jeng Huang
- Applicant: Jen-Chi Chuang , Yung-Fa Lin , Ming-Jeng Huang
- Applicant Address: TW HSINCHU TW HSIN-CHU TW TAOYUAN TW HSINCHU TW HSINCHU
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE,POWERCHIP SEMICONDUCTOR CORP.,NANYA TECHNOLOGY CORPORATION,PROMOS TECHNOLOGIES INC.,WINBOND ELECTRONICS CORP.
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE,POWERCHIP SEMICONDUCTOR CORP.,NANYA TECHNOLOGY CORPORATION,PROMOS TECHNOLOGIES INC.,WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW HSINCHU TW HSIN-CHU TW TAOYUAN TW HSINCHU TW HSINCHU
- Priority: TWTW97120577 20080603
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
An exemplary phase change memory device is provided, including a substrate with a first electrode formed thereover. A first dielectric layer is formed over the first electrode and the substrate. A plurality of cup-shaped heating electrodes is respectively disposed in a portion of the first dielectric layer. A first insulating layer is formed over the first dielectric layer, partially covering the cup-shaped heating electrodes and the first dielectric layer therebetween. A second insulating layer is formed over the first dielectric layer, partially covering the cup-shaped heating electrodes and the first dielectric layer therebetween. A pair of phase change material layers is respectively disposed on opposing sidewalls of the second insulating layer and contacting with one of the cup-shaped heating electrodes. A pair of first conductive layers is formed on the second insulating layer along the second direction, respectively.
Public/Granted literature
- US07858961B2 Phase change memory devices and methods for fabricating the same Public/Granted day:2010-12-28
Information query
IPC分类: