发明申请
US20090294796A1 Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device 有权
粘合促进剂,固化有机聚硅氧烷组合物和半导体装置

Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device
摘要:
An adhesion-promoting agent represented by the following average formula: R1aSiO(4-a/2 (where R1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R1; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R1; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R1; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R1; and “a” is a number that satisfies the following condition: 1.0≦a
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