发明申请
- 专利标题： INTEGRATED CIRCUIT SYSTEM EMPLOYING BACK END OF LINE VIA TECHNIQUES
- 专利标题（中）： 集成电路系统采用线路技术的后端
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申请号： US12132342申请日： 2008-06-03
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公开(公告)号： US20090294904A1公开(公告)日： 2009-12-03
- 发明人: Shaoqing Zhang , Fan Zhang , Shao-fu Sanford Chu , Bei Chao Zhang
- 申请人： Shaoqing Zhang , Fan Zhang , Shao-fu Sanford Chu , Bei Chao Zhang
- 申请人地址： SG Singapore
- 专利权人： CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
- 当前专利权人： CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L21/283
- IPC分类号： H01L21/283 ; H01L21/02 ; H01L29/92
摘要：
An integrated circuit system that includes: providing a substrate including front-end-of-line circuitry; forming a first metallization layer over the substrate and electrically connected to the substrate; forming a viabar or a via group over the first metallization layer; and forming a second metallization layer over the first metallization layer and electrically connected to the first metallization layer through either the viabar or the via group.
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