发明申请
- 专利标题： HEAT DISSIPATION DEVICE
- 专利标题（中）： 散热装置
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申请号： US12406087申请日： 2009-03-17
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公开(公告)号： US20090301690A1公开(公告)日： 2009-12-10
- 发明人: Wei Li , Yi-Qiang Wu , Chun-Chi Chen
- 申请人： Wei Li , Yi-Qiang Wu , Chun-Chi Chen
- 申请人地址： CN Shenzhen City TW Tu-Cheng
- 专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人地址： CN Shenzhen City TW Tu-Cheng
- 优先权： CN200810067578.3 20080604
- 主分类号： F28F7/00
- IPC分类号： F28F7/00
摘要：
A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a securing device. The securing device includes a holder fixed to the substrate and a plurality of elastic fasteners. The fasteners secure the fan onto the holder and each includes a sandwiched portion sandwiched between the fan and the holder to segregate the fan from the holder.
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