发明申请
- 专利标题： WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 包括导电核心基板的接线基板及其制造方法
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申请号： US12331113申请日： 2008-12-09
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公开(公告)号： US20090308651A1公开(公告)日： 2009-12-17
- 发明人: Tomoyuki ABE , Kazumasa SAITO , Shin HIRANO , Kenji IlDA
- 申请人： Tomoyuki ABE , Kazumasa SAITO , Shin HIRANO , Kenji IlDA
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2007-321910 20071213
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K3/10
摘要：
A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole.
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