发明申请
- 专利标题: COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH JET IMPINGEMENT STRUCTURE INTEGRALLY FORMED ON THERMALLY CONDUCTIVE PIN FINS
- 专利标题(中): 冷却装置及其制造方法,其结构整体形成于导热引线芯上
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申请号: US12141290申请日: 2008-06-18
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公开(公告)号: US20090314467A1公开(公告)日: 2009-12-24
- 发明人: Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
- 申请人: Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: F28F7/00
- IPC分类号: F28F7/00
摘要:
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: bonding a plurality of thermally conductive pin fins to a surface to be cooled, each pin fin including a stem with a bulb structure on its distal end; depositing material onto the plurality of thermally conductive pin fins to integrally form a jet impingement structure with the pin fins, wherein the distal ends of the plurality of thermally conductive pin fins form part of the jet impingement structure; and controlling the depositing of material onto the distal ends of the pin fins to form a plurality of jet orifices in the jet impingement structure, with the depositing resulting in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins.
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