公开(公告)号：US09038406B2

公开(公告)日：2015-05-26

申请号：US12787807

申请日：2010-05-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28D1/047 ,  F28F1/12 ,  F28F1/32 ,  F28F17/00 ,  F28D1/053 ,  F28D21/00

CPC分类号： H05K7/202 ,  F28D1/0471 ,  F28D1/0475 ,  F28D1/05366 ,  F28D2021/0038 ,  F28F1/126 ,  F28F1/32 ,  F28F17/005 ,  H05K7/20218 ,  H05K7/20318 ,  H05K7/20572 ,  H05K7/20609 ,  H05K7/20627 ,  H05K7/20645 ,  H05K7/20736 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

摘要： Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

摘要翻译： 为电子机架提供除湿冷却装置和方法。 该设备包括设置在机架的空气入口或出口侧的空气 - 液体热交换器，其定位成使空气通过电子机架以通过热交换器。 热交换器与冷却剂回路流体连通，以在低于通过热交换器的空气的露点温度的温度下使冷却剂通过，使得通过热交换器的空气被除湿和冷却。 设置在热交换器下方的冷凝水收集器从通过电子机架的空气的除湿收集液体冷凝物，其中热交换器包括多个倾斜表面，其被构造成便于将液体冷凝物从热交换器排出到冷凝水收集器。

公开(公告)号：US08953317B2

公开(公告)日：2015-02-10

申请号：US13281669

申请日：2011-10-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H02B1/00 ,  H02B1/56 ,  H05K7/20 ,  F28F7/00 ,  F28D15/00 ,  H01L23/12 ,  H01L23/34 ,  H01B7/42 ,  F28D1/047 ,  F28D15/02

CPC分类号： F28D1/0477 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment. The wicking component(s) facilitates drawing condensed fluid from a surface of the thermally conductive condenser fin(s) and thereby enhances heat transfer across the surface of the condenser fin(s).

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括壳体，其至少部分围绕电子部件围绕并形成流体密封的隔室，以及布置在流体密封隔室内的电介质流体，电子部件浸入介电流体内。 还提供蒸气冷凝器和一个或多个芯吸部件。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且芯吸部件设置在流体密封室内，与至少一部分一个或多个导热冷凝器物理接触 在隔室内延伸的导热冷凝器翅片的翅片。 芯吸部件有助于从导热性冷凝器翅片的表面吸收冷凝流体，从而增强横跨冷凝器翅片的表面的热传递。

公开(公告)号：US08941994B2

公开(公告)日：2015-01-27

申请号：US13613753

申请日：2012-09-13

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F3/00

CPC分类号： H05K7/20309 ,  B23P15/26 ,  F28D9/0025 ,  F28D15/02 ,  F28F3/046 ,  F28F3/12 ,  F28F9/02 ,  H05K7/203 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49396

摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

摘要翻译： 提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 蒸汽冷凝通道。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道

公开(公告)号：US08760863B2

公开(公告)日：2014-06-24

申请号：US13285105

申请日：2011-10-31

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K5/00 ,  H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20709 ,  H05K7/20781

摘要： A multi-rack assembly is provided which includes adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

摘要翻译： 提供了一种多机架组件，其包括相邻的第一和第二电子机架，每个电子机架至少部分地是空气冷却的，以及与第一机架相关联的空气与液体热交换器，用于冷却通过 第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。

公开(公告)号：US20140071627A1

公开(公告)日：2014-03-13

申请号：US13613873

申请日：2012-09-13

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28D15/02 ,  H05K7/20

CPC分类号： H05K7/20809 ,  F28D15/02 ,  F28D15/046 ,  F28F3/048 ,  H05K7/203

摘要： Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

摘要翻译： 提供冷却装置和方法用于多个电子部件的部分浸没冷却。 冷却装置包括至少部分围绕部件周围并形成隔室的壳体以及设置在隔间内的流体。 第一和第二电子部件至少部分地不浸在流体内，其中第一部件是与第二部件不同的构造的不同类型的电子部件。 蒸汽冷凝器设置有设置在隔间内的蒸汽冷凝表面，用于冷凝流体蒸气，并且冷凝物重新导向结构设置在蒸气冷凝器和第一和第二部件之间的隔间内。 与第二电子部件相比，重定向结构在第一电子部件上被不同地配置，并且与第二部件相比，在第一部件上提供了不同的冷凝物滴落模式。

公开(公告)号：US08619425B2

公开(公告)日：2013-12-31

申请号：US13281945

申请日：2011-10-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture. The cooling structure facilitates heat removal from the fluid-tight compartment.

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括至少部分围绕电子部件周围并形成流体密封的隔室的壳体，以及流体密封室内的第一和第二介电流体的沸腾流体混合物，其中电子部件 浸在混合物中。 冷凝流体也设置在流体密封室内，并与沸腾的流体混合物不混溶。 冷凝液具有比沸腾流体混合物更低的比重和更高的热导率，并且有助于蒸发的沸腾流体混合物的冷凝。 冷却结构设置在隔室内，并且包括冷凝区域和副冷却区域，其中冷凝区域与冷凝流体接触，并且副冷却区域与沸腾流体混合物接触。 冷却结构便于从流体密封隔室中的热量去除。

公开(公告)号：US20130105122A1

公开(公告)日：2013-05-02

申请号：US13281669

申请日：2011-10-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/04

CPC分类号： F28D1/0477 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment. The wicking component(s) facilitates drawing condensed fluid from a surface of the thermally conductive condenser fin(s) and thereby enhances heat transfer across the surface of the condenser fin(s).

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括壳体，其至少部分围绕电子部件围绕并形成流体密封的隔室，以及布置在流体密封隔室内的电介质流体，电子部件浸入介电流体内。 还提供蒸气冷凝器和一个或多个芯吸部件。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且芯吸部件设置在流体密封室内，与至少一部分一个或多个导热冷凝器物理接触 在隔室内延伸的导热冷凝器翅片的翅片。 芯吸部件有助于从导热性冷凝器翅片的表面吸收冷凝流体，从而增强横跨冷凝器翅片的表面的热传递。

公开(公告)号：US20130021752A1

公开(公告)日：2013-01-24

申请号：US13187556

申请日：2011-07-21

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

IPC分类号： H05K7/20 ,  H05K13/00 ,  F28F7/00

CPC分类号： H05K13/00 ,  F28D15/02 ,  F28D2021/0028 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K7/20236 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/49002 ,  Y10T29/49353 ,  H01L2924/00

摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.

摘要翻译： 提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。 冷却的电子模块包括支撑电子部件的基板，并且冷却装置耦合到基板，并且包括至少部分围绕电子部件周围并形成隔室的壳体。 此外，冷却装置包括设置在隔室内的流体和去离子结构。 电子部件至少部分地浸没在流体内，并且流体是水基流体。 去离子结构包括去离子材料，其确保隔室内的流体的去离子。 去离子结构便于从电子部件到设置在隔室中的冷凝器结构的沸腾热传递。 随后将转移的热量传送到例如冷却冷凝器结构的液冷冷板或连接到壳体的风冷散热片。

公开(公告)号：US08322029B2

公开(公告)日：2012-12-04

申请号：US13087678

申请日：2011-04-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith F. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith F. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K3/20 ,  F28F7/00

CPC分类号： H01L23/3677 ,  H01L2224/78301 ,  Y10T29/49128 ,  Y10T29/4935 ,  H01L2924/00014

摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

摘要翻译： 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并且部分地延伸在较低热通量的第二区域上，其中第一和第二区域是要冷却的表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

公开(公告)号：US08230906B2

公开(公告)日：2012-07-31

申请号：US12850104

申请日：2010-08-04

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H05K7/20218

摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

摘要翻译： 为多流体电子冷却系统和方法提供双室流体泵。 泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。 第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。 将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸 第一流体冷却剂进入第一泵送室。