发明申请
US20090314742A1 METHOD FOR PROCESSING SUBSTRATE AND METHOD FOR PRODUCING LIQUID EJECTION HEAD AND SUBSTRATE FOR LIQUID EJECTION HEAD
有权
用于处理基板的方法和用于生产液体喷射头的方法和用于液体喷射头的基板
- 专利标题： METHOD FOR PROCESSING SUBSTRATE AND METHOD FOR PRODUCING LIQUID EJECTION HEAD AND SUBSTRATE FOR LIQUID EJECTION HEAD
- 专利标题（中）： 用于处理基板的方法和用于生产液体喷射头的方法和用于液体喷射头的基板
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申请号： US12484937申请日： 2009-06-15
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公开(公告)号： US20090314742A1公开(公告)日： 2009-12-24
- 发明人: Keisuke Kishimoto , Satoshi Ibe , Takuya Hatsui , Shimpei Otaka , Hiroto Komiyama , Hiroyuki Morimoto , Masahiko Kubota , Toshiyasu Sakai
- 申请人： Keisuke Kishimoto , Satoshi Ibe , Takuya Hatsui , Shimpei Otaka , Hiroto Komiyama , Hiroyuki Morimoto , Masahiko Kubota , Toshiyasu Sakai
- 申请人地址： JP Tokyo
- 专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-159116 20080618; JP2008-159124 20080618
- 主分类号： G01D15/18
- IPC分类号： G01D15/18
摘要：
A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.
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