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    Substrate for inkjet printing head and method for manufacturing the substrate
    3.
    发明授权
    Substrate for inkjet printing head and method for manufacturing the substrate 有权
    用于喷墨打印头的基板和用于制造基板的方法

    公开(公告)号：US08182072B2

    公开(公告)日：2012-05-22

    申请号：US12105931

    申请日：2008-04-18

    申请人： Satoshi Ibe ,  Hirokazu Komuro ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Hiroto Komiyama

    发明人： Satoshi Ibe ,  Hirokazu Komuro ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Hiroto Komiyama

    IPC分类号： B41J2/05

    CPC分类号： B41J2/1603 ,  B41J2/14129 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2002/14387 ,  B41J2202/18

    摘要： There is provided a substrate for an inkjet printing head and a method for manufacturing the same, in which the substrate has a structure that different kinds of metals do not come into contact with ink or moisture. For this purpose, the structure is constituted such that a diffusion preventing layer for mainly protecting a lower layer among power wiring metals is covered by a metal layer for mainly supplying power, in connection with its upper surface and at least part of a side surface. Herewith, since a single metal appears on a surface of the power wiring including up to its side surface, even circumstance occurs of coming into contact with the ink or the moisture, a battery reaction accompanied by difference of ionization tendency is not generated, and thus corrosion or short-circuit of the power wiring is suppressed.

    摘要翻译： 提供了一种用于喷墨打印头的基板及其制造方法，其中基板具有不同种类的金属不与墨水或湿气接触的结构。 为此，结构被构造成使得用于主要保护电力布线金属中的下层的扩散防止层由其上表面和至少一部分侧表面的主要供电的金属层覆盖。 因此，由于在直到其侧面的电力布线的表面上出现单个金属，所以即使发生与墨水或水分接触的情况，也不会产生伴随电离倾向差的电池反应，因此 抑制了电源线的腐蚀或短路。

    Method for manufacturing liquid discharge head
    4.
    发明授权
    Method for manufacturing liquid discharge head 有权
    液体排放头的制造方法

    公开(公告)号：US08177988B2

    公开(公告)日：2012-05-15

    申请号：US12203549

    申请日：2008-09-03

    申请人： Hiroto Komiyama ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Shimpei Otaka ,  Sadayoshi Sakuma

    发明人： Hiroto Komiyama ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Shimpei Otaka ,  Sadayoshi Sakuma

    IPC分类号： H01B13/00

    CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639

    摘要： A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a ×tan 54.7 degrees≦d, where a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.

    摘要翻译： 一种用于制造具有设置有液体供应口的硅基板的液体排出头基板的方法，包括在其一个侧面上准备设置有钝化膜的基板的步骤，具有第一凹部和第二凹部 设置在其中以便通过钝化膜从一个侧面穿透到内部部分，其中凹部满足a×tan 54.7度＆amp; nlE; d的关系，其中a被定义为第一凹部和第二凹部之间的距离 ，d被定义为第二凹部的深度，并且通过从一个侧面各向异性地蚀刻晶体来形成供给口。

    METHOD OF MANUFACTURING A SUBSTRATE FOR LIQUID EJECTION HEAD
    5.
    发明申请
    METHOD OF MANUFACTURING A SUBSTRATE FOR LIQUID EJECTION HEAD 有权
    液体喷射头基板的制造方法

    公开(公告)号：US20120058578A1

    公开(公告)日：2012-03-08

    申请号：US13215492

    申请日：2011-08-23

    申请人： Taichi Yonemoto ,  Hiroyuki Abo ,  Keisuke Kishimoto

    发明人： Taichi Yonemoto ,  Hiroyuki Abo ,  Keisuke Kishimoto

    IPC分类号： H01L21/306

    CPC分类号： B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646

    摘要： Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.

    摘要翻译： 本发明提供一种液体喷射头用基材的制造方法，其特征在于，包括：通过在硅基板的一个表面侧进行蚀刻来形成槽部，所述槽部形成为包围供给口的部分 形成在所述槽部的内侧; 在所述硅基板的一个表面侧上形成保护层，所述保护层形成在所述槽部内部和所述槽部的外侧; 以及通过使用保护层作为掩模对硅衬底进行结晶各向异性蚀刻处理来形成液体供给口。

    METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD
    6.
    发明申请
    METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD 有权
    液体放电头的制造方法

    公开(公告)号：US20090065482A1

    公开(公告)日：2009-03-12

    申请号：US12203651

    申请日：2008-09-03

    申请人： Hiroto Komiyama ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Kazuhiro Asai ,  Shimpei Otaka

    发明人： Hiroto Komiyama ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Kazuhiro Asai ,  Shimpei Otaka

    IPC分类号： B44C1/22

    CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639

    摘要： Provided is a method of manufacturing a substrate for a liquid discharge head, the substrate including a silicon substrate with a liquid supply opening formed therein, the method including: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.

    摘要翻译： 本发明提供一种液体排出头用基板的制造方法，其特征在于，具备形成有液体供给口的硅基板的基板，其特征在于，具备：在所述基板的一个表面上通过激光加工形成1个处理部; 通过在与所述一个处理部分的一部分重叠的位置处进行激光处理并且不与所述一个处理部分的另一部分重叠来扩展所述一个处理部分以形成凹部; 并且从一个表面蚀刻具有形成在其中的凹部的基板以形成液体供应​​开口。

    METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD
    7.
    发明申请
    METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD 有权
    制造液体放电头的方法

    公开(公告)号：US20090065476A1

    公开(公告)日：2009-03-12

    申请号：US12203549

    申请日：2008-09-03

    申请人： Hiroto Komiyama ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Shimpei Otaka ,  Sadayoshi Sakuma

    发明人： Hiroto Komiyama ,  Hirokazu Komuro ,  Satoshi Ibe ,  Takuya Hatsui ,  Keisuke Kishimoto ,  Shimpei Otaka ,  Sadayoshi Sakuma

    IPC分类号： B44C1/22

    CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639

    摘要： A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a×tan 54.7 degrees≦d, when a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.

    摘要翻译： 一种用于制造具有设置有液体供应口的硅基板的液体排出头基板的方法，包括在其一个侧面上准备设置有钝化膜的基板的步骤，具有第一凹部和第二凹部 设置在其中以便通过所述钝化膜从所述一个侧面穿透到所述内部，其中当所述凹陷被定义为所述第一凹部和所述第二凹部之间的距离时，所述凹部满足斧头的关系为54.7度< d定义为第二凹部的深度，并且通过从一个侧面各向异性地蚀刻晶体来形成供给口。

    METHOD FOR PRODUCING LIQUID-DISCHARGE-HEAD SUBSTRATE
    10.
    发明申请
    METHOD FOR PRODUCING LIQUID-DISCHARGE-HEAD SUBSTRATE 有权
    生产液体放电头基板的方法

    公开(公告)号：US20120329181A1

    公开(公告)日：2012-12-27

    申请号：US13526958

    申请日：2012-06-19

    申请人： Ryotaro Murakami ,  Shuji Koyama ,  Keisuke Kishimoto ,  Kenta Furusawa

    发明人： Ryotaro Murakami ,  Shuji Koyama ,  Keisuke Kishimoto ,  Kenta Furusawa

    IPC分类号： H01L21/02

    CPC分类号： B41J2/1603 ,  B41J2/1629 ,  B41J2/1634 ,  B41J2/1639

    摘要： A method for producing a liquid-discharge-head substrate includes a step of preparing a silicon substrate including, at a front-surface side of the silicon substrate, an energy generating element; a step of forming a first etchant introduction hole on the front-surface side of the silicon substrate; a step of supplying a first etchant into the first etchant introduction hole formed on the front-surface side of the silicon substrate, and supplying a second etchant to a back-surface side of the silicon substrate; a step of stopping the supply of the second etchant; and a step of, after the supply of the second etchant has been stopped, forming a liquid supply port extending through front and back surfaces of the silicon substrate by the supply of the first etchant.

    摘要翻译： 一种液体排出头基板的制造方法，其特征在于，包括在所述硅基板的表面侧具有能量产生元件的硅基板的制造工序。 在所述硅基板的表面侧形成第一蚀刻剂导入孔的工序; 向在硅衬底的前表面侧形成的第一蚀刻剂引入孔中提供第一蚀刻剂并将第二蚀刻剂供应到硅衬底的背表面的步骤; 停止供应第二蚀刻剂的步骤; 以及在第二蚀刻液的供应已经停止之后，通过供给第一蚀刻剂形成延伸穿过硅衬底的前表面和后表面的液体供给口的步骤。