The frame (1) comprises an intermediate layer (5) sandwiched between a first layer (3) with a first pattern and a second layer (4) with a second pattern. Adhesion layers (2,12) are present on the first and second layer (3,4) respectively. The patterns are defined such that bumping portions (31) and a cap (21) are defined. The intermediate layer (5) is continuous and extends over spaces (25) between bumping portions (31) and the cap (21), so as to prevent disintegration. The frame is assembled to a device (50) with an electronic element (52), such as a MEMS element. The cap (21) then encapsulates a cavity (60) over the element (52).