发明申请
- 专利标题: CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 电路连接材料,薄膜形成电路连接材料,电路部件连接结构及其制造方法
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申请号: US12557076申请日: 2009-09-10
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公开(公告)号: US20090321116A1公开(公告)日: 2009-12-31
- 发明人: Motohiro Arifuku , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
- 申请人: Motohiro Arifuku , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
- 优先权: JPP2003-181593 20030625
- 主分类号: H05K1/09
- IPC分类号: H05K1/09 ; H05K1/11 ; H05K1/03
摘要:
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.