发明申请
- 专利标题： LOW THERMAL MASS SEMICONDUCTOR WAFER SUPPORT
- 专利标题（中）： 低热量半导体波长支持
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申请号： US12165048申请日： 2008-06-30
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公开(公告)号： US20090321372A1公开(公告)日： 2009-12-31
- 发明人: Brian Lawrence Gilmore , Lance G. Hellwig
- 申请人： Brian Lawrence Gilmore , Lance G. Hellwig
- 申请人地址： US MO St. Peters
- 专利权人： MEMC ELECTRONIC MATERIALS, INC.
- 当前专利权人： MEMC ELECTRONIC MATERIALS, INC.
- 当前专利权人地址： US MO St. Peters
- 主分类号： H01L21/673
- IPC分类号： H01L21/673
摘要：
A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.
公开/授权文献
- US08042697B2 Low thermal mass semiconductor wafer support 公开/授权日：2011-10-25
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