A device under test (DUT) is tested via a test interposer. The test interposer includes a first set of contacts at a first surface to interface with the contacts of a load board or other interface of an automated test equipment (ATE) and a second set of contacts at an opposing second surface to interface with the contacts of the DUT. The second set of contacts can have a smaller contact pitch than the contact pitch of the first set of contacts to facilitate connection to the smaller pitch of the contacts of the DUT. The test interposer further includes one or more active circuit components or passive circuit components to facilitate testing of the DUT. The test interposer can be implemented as an integrated circuit (IC) package that encapsulates the circuit components.